GUANGZHOU, China, June 16, 2011 /PRNewswire/ —
Altair Semiconductor (http://www.altair-semi.com),
the world’s leading developer of ultra-low power, small footprint
and high performance 4G LTE
chipsets, announced today that its TD-LTE chipset, integrated
in a USB dongle developed by AsiaTelco Technologies, achieved
download speeds of more than 50Mbps and upload speeds of more than
18Mbps in a live over-the-air demonstration requested by executives
from China Mobile during last week’s NGMN (Next Generation Mobile
Network) Alliance board meeting. As part of the executive
demonstration, Altair’s chipset provided high speed broadband
internet service for meeting participants.
Altair, which is shipping one of the first commercial TDD/FDD
LTE chipsets in the market today, has established a
strong leadership position in the emerging TD-LTE market. The
company’s chipset has already demonstrated the highest performance
of any other TD-LTE solution in India and Japan, and prior to last
week’s demo at the NGMN meeting, has completed several months of
rigorous testing with China Mobile.
“The combination of AsiaTelco’s strong product integration
expertise and our field proven TD-LTE chipsets has allowed us to
bring one of the first commercial grade TD-LTE solutions to
market,” said Eran Eshed, Co-Founder and VP of Marketing and
Business Development at Altair Semiconductor. “Our customers not
only benefit from a very mature and field proven TD-LTE solution,
they also get to use the exact same chipset and software platform
to serve FDD LTE markets – and in any LTE frequency band globally.
This is an extremely valuable proposition which provides us with
tremendous market
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