RANDOLPH, N.J., July 27, 2011 /PRNewswire/ — Douglas Electrical
Components (DECo) (www.douglaselectrical.com)
has developed back potted epoxy hermetic seals as fast, flexible,
reliable and low-cost alternatives to expensive standard ceramic or
glass seals. The back potted epoxy seals provide a fully harnessed
pressure and vacuum sealing solution that can be customized to meet
customer needs.

DECo can provide fully harnessed back potting solutions that
avoid some of the drawbacks associated with generic glass or
ceramic connectors, which traditionally come supplied with only
solder cups or PCB tails and create potential points of failure.
Without a wire harness, these connectors also need additional
assembly work, and potential investment in tooling, training,
quality control and testing. With a nimble solution not limited by
months of turnaround time, engineers are able to respond more
quickly to changes in design.

“We engineered our back potting solution to allow us to use
common connector and wire harness materials and our own epoxy
material, providing the customer with a totally customized and
prewired solution in weeks instead of months,” said Ed Douglas,
president of Douglas Electrical Components. “At DECo, we recognize
that connectors should be seamlessly integrated into a project
rather than cause for costly delays.”

Design engineers can specify from a range of commonly available
plastic and metal connectors, from jam-nut and o-ring to wall
mount, radial o-ring and others including the accommodation of
fiber optic connectors and cables. Today’s range of
high-performance epoxies has greatly extended the application range
of this versatile hermetic sealing option; the DECo epoxy material
can withstand pressure up to 15,000 PSI and temperatures ranging
from cryogenic to over 350 F.

Current application areas for back potted seals include: lasers,
sealed electronic cavities, semicondu

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