DTP Thermoelectrics secures patent for new thermoelectric tech

DTP Thermoelectrics (Pasadena, California) recently announced that it has secured a U.S. patent for what it describes as a first-of-its-kind thermoelectric system.

According to the company, the patent opens the door for solid-state, deep-cooling thermal management. It enables a new class of solid-state thermal management systems. The company said the new system has capabilities previously only possible with much larger and heavier mechanical cooling systems.

DTP Thermoelectrics based the patent on theoretical and analytical models validated through the fabrication and characterization of thermoelectric devices that use distributed transport properties (DTP) thermoelectric materials.

Sample tests used standard protocols. They demonstrated significant increases in maximum cooling temperature, efficiency (COP) and cooling power, according to the company.

“There is no better performing thermoelectric material system than what we have fabricated with our DTP technology,” DTP Thermoelectrics CEO Lon E. Bell said in a Sept. 28 news release.

“This mass-producible, proprietary technology increases cooling capacity at efficiencies greater than what is possible with other thermoelectric devices,” Bell said. “DTP technology has the potential to improve cooling and thermal management system performance and cost-effectiveness in Lidar, infrared sensors, electronics, cold chain storage, medical devices, battery thermal management and vision systems.”

More about the new thermoelectric tech

Recent semiconductor material manufacturing advances partially enabled the DTP Thermoelectrics’ technology, said the company’s CTO Douglas Crane, Chief Technology Officer. “Using both modifications to available thermoelectric materials and advanced manufacturing technology, we can generate precise performance outputs. By starting with our higher efficiency thermoelectric systems and controlling the relationship between power density and COP that DTP technology enables, we can tailor performance to specific applications.”

The new patent is for “Thermoelectric Systems Employing Distributed Transport Properties to Increase Cooling and Heating Performance.” (It’s No. 11,421,919 by the United States Patent and Trademark Office). It covers DTP technology and its ability to increase cooling and heating performance in solid-state heat pumps.

DTP Thermoelectrics seeks to create proprietary next-generation thermoelectric technology to improve thermal management in a broad range of product sectors. Company officials think their tech could help with electric vehicles, electronic components, cold chain portable coolers, medical devices, HVAC equipment, and emerging applications.