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EP30Med: Low viscosity epoxy meets USP class VI specifications

May 10, 2016 By Abigail Esposito

epoxy

Master Bond EP30Med offers effective electrical insulation properties and exceptionally low shrinkage upon cure.

Ideal for encapsulation, bonding and sealing applications, Master Bond EP30Med offers effective electrical insulation properties and exceptionally low shrinkage upon cure.

It is a two component, room-temperature curing biocompatible epoxy adhesive designed for high performance medical device applications. It features high bond strength, durability, resistance chemicals and cold sterilants, such as EtO and gamma radiation. It also meets FDA requirements for indirect food contact as per FDA CFR 175.105.

Key features the epoxy provides are:

  • biocompatibility as per USP class VI testing,
  • FDA CFR 175.105 specification for indirect contact with food,
  • excellent electrical insulation properties and
  • superior chemical resistance particularly to sterilants.

Master Bond
www.masterbond.com

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  • Home
  • Medical Device Business
    • Mergers & Acquisitions
    • Financial
    • Regulatory
  • Applications
    • Cardiovascular
    • Devices
    • Imaging
    • Implantables
    • Medical Equipment
    • Orthopedic
    • Surgical
  • Technologies
    • Contract Manufacturing
    • Components
    • Electronics
    • Extrusions
    • Materials
    • Motion Control
    • Prototyping
    • Pumps
    • Tubing
  • Med Tech Resources
    • DeviceTalks Tuesdays
    • Digital Editions
    • eBooks
    • Manufacturer Search
    • Medical Device Handbook
    • MedTech 100 Index
    • Podcasts
    • Print Subscription
    • The Big 100
    • Webinars / Digital Events
    • Whitepapers
    • Video
  • 2022 Leadership in MedTech
    • 2022 Leadership Voting!
    • 2021 Winners
    • 2020 Winners
  • Women in Medtech