Molex Incorporated recently introduced its new High-Speed Low-Loss Flex Circuit Assemblies, made using DuPont Pyralux TK flexible circuit material. The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.
Molex is one of the first manufacturers to incorporate DuPont Pyralux TK flexible circuit material into the volume production of multi-layer flexible circuit constructions. Pyralux TK is a double-sided flexible copper clad laminate and bonding film system formulated with DuPont Teflon fluoropolymer film and DuPont Kapton polyimide film. It provides exceptional electrical performance for high speed digital and high frequency flexible circuit applications.
The dielectric constant and low-loss capabilities of Pyralux TK deliver a mechanically flexible construction, tighter bend radii and faster transmission than standard flexible assemblies.
Molex High-Speed Low-Loss Flex Circuit Assemblies are available with self-coiling or mechanically-assisted coiling, offering options for flexible three dimensional packaging, minimizing insertion loss and providing improved airflow compared to a standard PCB design.
For more information about High-Speed Low-Loss Flex Circuit Assemblies plesae visit www.molex.com/link/hsllflexassemblies.html.