NEO Tech offers microelectronics miniaturization for medical implantable device OEMs


NEO Tech’s miniaturized electronic manufacturing capabilities will be used in implantable devices and electroceuticals in the medical industry.

NEO Tech, a provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announced that its highly miniaturized electronic manufacturing capabilities were being deployed in advanced implantable devices and electroceuticals for the medical industry.

Advanced implantable devices such as neuro stimulation devices, drug pumps, cochlear implants, sensors and wireless communication functions require advanced microelectronics. NEO Tech has the experience and capability to support OEMs which are pushing the technology boundaries of implantable solutions.

Implantable medical device manufacturers make use of NEO Tech’s microelectronics capabilities through services such as:

  • Miniaturization by use of microelectronic high density packaging technologies;
  • Interactive DFM/DFT;
  • Electrical, mechanical and thermal analysis; and
  • Development of electrical, functional and environmental tests that support high-reliability manufacturing.

NEO Tech’s medical microelectronics manufacturing sites are ISO13485:2003 certified. Microelectronic capabilities include:

  • Wafer & Die Processing;
  • Die attach using a variety of epoxies and other materials;
  • Placement capability of all device types including RF and MMIC devices;
  • Automated wire bonding including gold and aluminum wedge, and gold ball bonding; and
  • Custom microelectronic packaging, including multichip packaging (MCP), multichip modules (MCM), power modules, chip-on-board (COB) and chip-scale-modules (CSM).

The microelectronic assembly and test services are carried out in NEO Tech’s cleanrooms. This area, as well as the main production areas, feature complete environmental controls.

The company has experience providing microelectronic manufacturing services for a wide variety of implanted medical applications, including:

  • Neuro stimulators incorporating high I/O, custom ASIC chip-on-board technology for a high level of integration and miniaturization;
  • Implantable RF transceivers that operate at 400 MHz ISM band for implantable medical device communication and programming;
  • Microelectronics for cochlear implants; and
  • Bion devices used for stimulation and sensing.

NEO Tech

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