NuSil Technology LLC will officially debut two new silicone products in San Francisco at Photonics West 2013. NuSil’s Engineering and Electronics business unit has developed LS2-6140, an optically clear primerless encapsulant, and R-2175, a flowable, thermally stable potting compound, as part of concentrated efforts to increase market specialization in the fast-paced industries sectors it serves.
LS2-6140 is a low viscosity, optically clear silicone encapsulant that offers strong adhesion to ceramic and common plastics used for electronic components without the need for primer. This versatile elastomer has a 45 Type A durometer and is optically stable with a refractive index (RI) of 1.40. Ideal for use in High Power and UV LED applications, it can be used to bond or encapsulate optical components that will be exposed to high lumen intensity at elevated temperatures. The low viscosity of LS2-6140 allows for processing by way of spin coating, dispensing, casting or compression molding.
LS2-6140 used in a 1.2 W package
R-2175 is a black, pourable, versatile silicone potting compound adept at providing support for electronics packages such as power supplies, sensors, and AC/DC and DC/DC high efficiency convertors. Its rheology yields a conformal material that works well with complex geometries and its 0.4 W/mK thermal conductivity helps dissipate heat. R-2175 comes in a variety of packaging configurations to ease transition into any manufacturing environment.
R-2175 potting an electronic unit
LS2-6140 and R-2175 have been tested per UL 94 and passed V0 and are REACH and ROHS compliant. NuSil technical staff will be at Photonics West Booth Number #5222 February 5, 6, and 7 to discuss and showcase these products.
NuSil Technology LLC
www.nusil.com
