
Promex Industries President and COO Dave Fromm [Photo courtesy of Promex]
Fromm will oversee strategic direction, operational execution and the the packaging and assembly company’s growth.
Promex Industries and QP Technologies CEO Dick Otte formerly served as president.
“After more than 30 years leading this organization, I am pleased to pass the role of president to David Fromm,” Otte said in a news release. “Dave has demonstrated a keen ability to develop advanced manufacturing processes our customers require while also managing the complexity of a growing business. He has the skills, drive, and vision to take our companies to the next stage of growth.”
More from Otte: Heterogenous integration packs big innovation into small medical devices
Promex said Fromm has been a key part in developing specialized manufacturing processes for complex microelectronics assemblies and earning the trust of customers and leadership.
Before joining Promex as VP of engineering in 2023, Fromm led research and development efforts for next-generation hardware and technology platforms at Cepheid as director of instrument research. He built a foundation in precision instrumentation and scientific innovation through research positions at Agilent Technologies after earning a Ph.D in physical chemistry from Stanford.
“I am honored to take on this role and excited about what lies ahead,” Fromm said in the release. “Over the decades, Promex and QP Technologies have built something truly special: a reputation for solving the hardest problems in microelectronics assembly and delivering for customers when it matters most.
“My focus will be on building on that foundation, investing in our people, expanding our capabilities, and continuing to be the partner our customers turn to for their most demanding applications,” he continued. “The market for advanced microelectronics assembly is growing, and I believe we are exceptionally well positioned to serve it. I look forward to leading this team into that next chapter.”
More from Fromm: Navigating thermally induced dynamics when developing miniaturized medical devices



