The Primoceler technology out of Finland is meant to enable the manufacture of vacuum-tight, ultra-miniature, ultra-reliable medical implants.
Financial terms of the deal, announced Monday, were not disclosed.
Primoceler’s glass bonding method is based on laser technology and does not need heat or added materials. It allows for device packaging for sensitive electronics made with only transparent materials, such as glass. Think wafer level chip scale packaging (WL-CSP) for a range of applications including medical implants, MEMS devices, and other reliability-critical electronic and optical devices.
Schott plans to vertically integrate Primoceler’s hermetic bonding services alongside its longstanding core competence of hermetic packaging components.