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TE Connectivity to acquire MEMS manufacturer Silicon Microstructures

September 23, 2019 By Nancy Crotti

TE Connectivity SMI Pressure SensorsSchaffhausen, Switzerland-based TE Connectivity (NYSE:TEL) subsidiary Measurement Specialties signed an agreement on Friday to acquire Silicon Microstructures (Milpitas, Calif.) from Elmos Semiconductor AG (ELG.F). The parties expect to close the transaction this calendar year.

TE said the acquisition would expand its pressure-sensing technology business, particularly in medical, transportation, and industrial applications. It would also bring together SMI’s micro-electro-mechanical systems (MEMS) sensor technology design and manufacturing capabilities with TE’s operational scale, customer base and existing sensors technologies into a more comprehensive global sensing solutions offering for customers.

“Silicon Microstructures’ MEMS pressure-sensing design and manufacturing capability is utilized in various applications requiring miniature design and high-performance packaging,” said John Mitchell, senior vice president and general manager of TE’s Sensor Solutions business unit, in a news release. “The MEMS low pressure sensing capability compliments TE’s pressure offering while strategically aligning to its market and application focus.”

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