J-Pac Medical, a trusted manufacturing and packaging outsourcing partner for medical device and diagnostic companies seeking to deliver superior quality, improve time-to-market and simplify their supply chain, today announced that it will now offer new high-volume automated manufacturing capabilities specifically designed for the company’s on-chip reagent blister technology.
J-Pac Medical’s full spectrum of automated production capabilities is designed for customers experiencing rapid growth in the commercialization of new microfluidic-based diagnostics — from prototyping, pilot production, clinical trials, product launch and full commercialization. As the market leader for reagent blisters, J-Pac can now manufacture tens of millions reagent blisters to support customers from concept through global commercialization.
J-Pac Medical’s unique high-volume, automated production capabilities have been developed to incorporate the highest precision for unit dose reagent blisters. This includes:
- Precision reagent filling for single and multiple-well formats with in-line quality control
- Self-diagnostics with automated detection of non-conforming materials
- Multiple sealing profiles unique to each customer application
Microfluidic diagnostic platforms utilizing J-Pac Medical’s on-chip reagent blisters help eliminate multi-step lab processes where human error and instrument contamination are most likely to occur. J-Pac has developed two reagent delivery technologies in single or multi-well formats for common lab-on-chip formats: burst and frangible seal blisters. Frangible and burst seal technology reduces test complexity by storing and enabling the controlled release of testing reagents, eliminating the need for complex fluid handling. As a result, the device manufacturer is able to better control performance variability, reduce overall manufacturing and disposal costs, and simplify the end-user experience.
J-Pac will be exhibiting in Booth 4272 at the 68th AACC Annual Scientific Meeting & Clinical Lab Expo taking place July 31st – August 4th in Philadelphia, PA.