Cicor Advanced Microelectronics & Substrates (AMS) division has capabilities to provide the medical market with complex printed-wiring boards (PWBs), thin-film and thick-film circuits on ceramics, glass, silicone, polyimide, liquid crystal polymer foils and more. To complete the portfolio, micro assembly is also offered, including all assembly technologies like SMT, flip chip bonding, gold, platinum and aluminum wire and ribbon bonding as well as testing of assembled circuits.
Cicor AMS is manufacturing high complex rigid and flex PWBs with a high level of miniaturization to support customers with leading-edge technology to fulfill the market needs and to increase patient comfort and acceptance. Ultra-thin, multilayer-flex PWBs up to eight layers with line widths and spacings as low as 2 mil, have become standard capabilities and are produced in volumes.
Cicor can offer turnkey solutions. All types of substrates manufactured by Cicor can subsequently be assembled and tested. An automatic assembly line in a cleanroom is available to assemble prototypes and low-to-medium volume assembly.
To better fulfill future needs, several merged technologies are available or under development at Cicor, such as biocompatible circuits that can be implanted directly without the need to encapsulate them. Biocompatible materials used are inert to body tissue and liquids. The circuits are manufactured with thin-film and PWB production processes.
Ultra-fine line, multilayer-circuits are manufactured using a thin-film process for patterning a PWB lamination. This technology lets Cicor manufacture circuits that have a higher circuit density than it would be possible using standard PWB technology.