LPKF Laser & Electronics, a manufacturer of laser systems for a variety of applications, will exhibit in booth 3509 throughout the three-day event, which takes place Feb. 14-16 at the San Diego Convention Center in San Diego.
The MicroLine 5000 is the industry’s answer to high through-put, high-yielding drilling applications. With the ability to drill holes down to 20 μm, a variety of both organic and inorganic substrates can be processed. Common applications include the drilling of through holes and blind vias, with the additional ability to cut large mounting holes, or full perimeter cuts of irregular board contours. Available with either a 10 W or 15 W laser source, the MicroLine 5000 series may also be configured to work with various material handling options.
The MicroLine 2820P was developed for cutting PCB panels and cover layers. It reduces lead times and eliminates tooling costs of layout changes. The substrates are held securely on a vacuum table. This is ideal for depaneling, cutting and engraving a variety of substrates (cover layers, rigid, flex and rigid/flex). UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required. In that case, the UV laser reduces the lead time and total costs with every new product layout.
Alongside these two new systems, LPKF will also feature information about its other primary technologies, for laser plastic welding and solder paste stencil cutting laser systems. Laser plastic welding technology is a hygienic, stress-free method of joining plastics. It is used widely in the automotive and medical device sectors. New features for the StencilLaser systems will also be highlighted including the ability to create step stencils as well as a new option for extending the working area of the StencilLaser G6080 model.
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